Hot melt glue machine with hand gun

Application of hot melt adhesive machine in paper industry

August 09 , 2021

The hot melt adhesive machine is also widely used in the paper packaging industry. When using the hot melt adhesive machine in paper packaging, we need to pay attention to the temperature control. When the hot melt adhesive machine is heated to 1.5 ~ 1.7 times its melting point, it is applied to the first layer of di (single-sided corrugated board). The hot melt adhesive has the most appropriate sizing viscosity at this temperature, so that the sizing amount can be properly controlled, The hot melt glue machine cools the di layer after gluing for 1 ~ 3S. When the temperature is 0.6 ~ 0.7 times of the melting point of the hot melt adhesive, the second layer is pasted. The viscosity of such adhesive increases so that it will not stick to the pressing plate. Of course, whether the hot melt adhesive sticks to the pressing plate is also related to the temperature of the pressing plate itself. If the pressing plate temperature is always maintained at 0.1 ~ 1.2 times of the melting point, the hot melt adhesive can melt immediately at this temperature and show strong viscosity, If this process is carried out by the hot-melt adhesive machine at a pre-controlled temperature, good and fast bonding can be achieved, and the subsequent cooling process will be greatly shortened. The performance of the hot-melt adhesive machine is good, and the glue dosage can be reduced to a very low degree. In this way, double-sided corrugated board can also be manufactured. When making double-sided corrugated board, the hot-melt adhesive with a melting point of 85 ~ 95 can be heated and melted. It is coated on the surface layer of Di base material and cooled to 50 ~ 70 (equivalent to 60% ~ 70% of the melting point of hot melt adhesive). At this time, the adhesive is partially cured, the second base material is pre heated to 90 ~ 110 degrees (equivalent to 1.0 ~ 1.2 times of the melting point of hot melt adhesive) and pasted on the bonding surface of Di base material in time. It can be pressed and cooled to 10 ~ 20 degrees.

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